International Conference on Thermoelectrics 2010Journal of electronic materials. 2011, Vol 40, Num 5, issn 0361-5235, 861 p.Conference Proceedings

An Introduction to System-Level, Steady-State and Transient Modeling and Optimization of High-Power-Density Thermoelectric Generator Devices Made of Segmented Thermoelectric ElementsCRANE, D. T.Journal of electronic materials. 2011, Vol 40, Num 5, pp 561-569, issn 0361-5235, 9 p.Conference Paper

Pb_1―xSn_xTe Alloys: Application ConsiderationsGELBSTEIN, Yaniv.Journal of electronic materials. 2011, Vol 40, Num 5, pp 533-536, issn 0361-5235, 4 p.Conference Paper

Thermoelectric Properties of Scaled Silicon Nanowires Using the sp³d⁵s^*-SO Atomistic Tight-Binding Model and Boltzmann TransportNEOPHYTOU, Neophytos; KOSINA, Hans.Journal of electronic materials. 2011, Vol 40, Num 5, pp 753-758, issn 0361-5235, 6 p.Conference Paper

Evaluating Thermoelectric Power Generation Device Performance Using a Rectangular Microchannel Heat SinkREZANIA, A; ROSENDAHL, L. A.Journal of electronic materials. 2011, Vol 40, Num 5, pp 481-488, issn 0361-5235, 8 p.Conference Paper

Application of the Transverse Thermoelectric EffectsGOLDSMID, H. J.Journal of electronic materials. 2011, Vol 40, Num 5, pp 1254-1259, issn 0361-5235, 6 p.Conference Paper

Discrete Finite-Element Simulation of Thermoelectric Phenomena in Spark Plasma SinteringJING ZHANG; ZAVALIANGOS, Antonios.Journal of electronic materials. 2011, Vol 40, Num 5, pp 873-878, issn 0361-5235, 6 p.Conference Paper

Seebeck Coefficient of Heavily P-Doped Si Calculated from an Alteration in Electronic Density of StatesSALLEH, Faiz; IKEDA, Hiroya.Journal of electronic materials. 2011, Vol 40, Num 5, pp 903-906, issn 0361-5235, 4 p.Conference Paper

A Four-Quadrant Operation Diagram for Thermoelectric Modules in Heating―Cooling Mode and Generating ModeCHIMCHAVEE, W.Journal of electronic materials. 2011, Vol 40, Num 5, pp 707-715, issn 0361-5235, 9 p.Conference Paper

Distribution of Elements in a Cu-Added FeSi₂ Alloy Under Peritectoid and Eutectoid ReactionsKIATGAMOLCHAI, Somchai; SAKULKALAVEK, Aparporn.Journal of electronic materials. 2011, Vol 40, Num 5, pp 1029-1034, issn 0361-5235, 6 p.Conference Paper

Seebeck Coefficient in Nonparabolic Bulk MaterialsBHATTACHARYA, Sitangshu; RAMESH CHANDRA MALLIK.Journal of electronic materials. 2011, Vol 40, Num 5, pp 1221-1232, issn 0361-5235, 12 p.Conference Paper

Thermoelectric Properties of Ca-Filled CoSb₃-Based Skutterudites Synthesized by Mechanical AlloyingPARK, Kwan-Ho; KIM, Il-Ho.Journal of electronic materials. 2011, Vol 40, Num 5, pp 493-498, issn 0361-5235, 6 p.Conference Paper

Thermoelectric Properties of Hot-Pressed and PECS-Sintered Magnesium-Doped Copper Aluminum OxideCHANG LIU; MORELLI, Donald T.Journal of electronic materials. 2011, Vol 40, Num 5, pp 678-681, issn 0361-5235, 4 p.Conference Paper

Solid-State Synthesis of Te-Doped Mg₂SiJUNG, Jae-Yong; KIM, Il-Ho.Journal of electronic materials. 2011, Vol 40, Num 5, pp 1144-1149, issn 0361-5235, 6 p.Conference Paper

Effect of Transition-Metal Additives on Thermoelectric Properties of YB₂₂C₂NPRYTULIAK, A; MORI, T.Journal of electronic materials. 2011, Vol 40, Num 5, pp 920-925, issn 0361-5235, 6 p.Conference Paper

Modeling of Thermally Induced Stresses in Three-Dimensional Bonded Integrated Circuit WafersJING ZHANG.Journal of electronic materials. 2011, Vol 40, Num 5, pp 670-673, issn 0361-5235, 4 p.Conference Paper

On Electronic Structure Engineering and Thermoelectric PerformanceJEONG, Changwook; LUNDSTROM, Mark.Journal of electronic materials. 2011, Vol 40, Num 5, pp 738-743, issn 0361-5235, 6 p.Conference Paper

Diffusive Thermoelectric Power in Highly Asymmetric Bilayer Graphene NanoribbonsBHATTACHARYA, Sitangshu; RAMESH CHANDRA MALLIK.Journal of electronic materials. 2011, Vol 40, Num 5, pp 1181-1189, issn 0361-5235, 9 p.Conference Paper

Size-Dependent Lattice Thermal Conductivity of Nanostructured Bulk SemiconductorsYANG, C. C; LI, S.Journal of electronic materials. 2011, Vol 40, Num 5, pp 953-956, issn 0361-5235, 4 p.Conference Paper

Microstructure and Thermoelectric Properties of AgSbO3 Ceramics Prepared by Ion-Exchange Powder Synthesis and Normal SinteringFU LI; LI, Jing-Feng.Journal of electronic materials. 2011, Vol 40, Num 5, pp 1035-1041, issn 0361-5235, 7 p.Conference Paper

A Thermoelectric Generator Using Engine Coolant for Light-Duty Internal Combustion Engine-Powered VehiclesSHIHO KIM; SOONSEO PARK; SUNKOOK KIM et al.Journal of electronic materials. 2011, Vol 40, Num 5, pp 812-816, issn 0361-5235, 5 p.Conference Paper

Development of Thermoelectric Self-Powered Heating EquipmentQIU, K; HAYDEN, A. C. S.Journal of electronic materials. 2011, Vol 40, Num 5, pp 606-610, issn 0361-5235, 5 p.Conference Paper

Granular and Lamellar Thermoelectric Oxides Consolidated by Spark Plasma SinteringNOUDEM, J. G; KENFAUI, D; CHATEIGNER, D et al.Journal of electronic materials. 2011, Vol 40, Num 5, pp 1100-1106, issn 0361-5235, 7 p.Conference Paper

Molecular Dynamics Study of the Structural and Mechanical Properties of Skutterudite CoSb₃: Surface EffectXUQIU YANG; LISHENG LIU; QINGJIE ZHANG et al.Journal of electronic materials. 2011, Vol 40, Num 5, pp 489-492, issn 0361-5235, 4 p.Conference Paper

Thermoelectric Properties of the Ca1―xRxMnO3 Perovskite System (R: Pr, Nd, Sm) for High-Temperature ApplicationsCHOI, Soon-Mok; LIM, Chang-Hyun; SEO, Won-Seon et al.Journal of electronic materials. 2011, Vol 40, Num 5, pp 551-556, issn 0361-5235, 6 p.Conference Paper